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Telcordia software to calculate the reliability prediction of electronic equipment based on the Telcordia (Bellcore) TR and SR standards. Free trial. Telcordia Telecom Information SuperStore – Reliability Prediction Procedure for The following documents were fully or partly replaced by SR TR Bellcore TR – Download as PDF File .pdf), Text File .txt) or read online.

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Some have gained popularity within industry in the past three decades.

Bellcore/Telcordia Predictions

Features Powerful and user friendly Telcordia telecom standard reliability prediction software Combine prediction methods for complex analysis Optimize designs to meet targeted goals Select components with regard to reliability and cost savings Be more accurate and efficient than with manual methods Take advantage of powerful ‘what if’ analytical tools Identify weak areas in a system design Build and open multiple systems and projects files Drag and drop components and systems between projects Powerful charting facilities ITEM ToolKit’s Reliability Prediction Modules Beellcore ToolKit contains five modules for performing reliability prediction MTBF analysis.

This empirically based model is known as the Arrhenius equation. These predictions provide necessary input to system-level reliability models for predicting expected downtime per year and system availability. Electronic devices with aluminum or aluminum alloy with small percentages of copper and silicon metallization are subject to corrosion failures and therefore can be described with the following model [11]:. It contains instructions for suppliers to follow when providing predictions of their device, unit, or serial system reliability.

One of the earliest and most tr3-32 acceleration models predicts how the time-to-failure of a system varies with temperature.

Bellcore/Telcordia Reliability Prediction in Lambda Predict

Among these approaches, three main categories are often used within government and industry: Powerful and user friendly Telcordia telecom standard reliability prediction software.

Usually, hr-332 lower the values, the more conservative the estimation.

Figure 5 shows the reliability rt-332 and the estimated B10 life at the usage temperature level. Notice 1 in and Notice 2 in However, in this section of the article, we are using the term life testing method to refer specifically to a third type of approach for predicting the reliability of electronic products. A brief summary from the publications in industry, military and academia is presented next []. View Table of Contents Payment Processing. It can also be used directly by telecommunications service providers for product reliability evaluation.

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The standard provides the generic failure rates and three part stress factors: As new sub blocks and components are added, ITEM ToolKit automatically recalculates all dependent failure rates to take account of new information.

Since the parts may not operate under the reference tr-323, the real operating conditions will result in failure rates that are different from those given belcore the “parts count” method.

The models allow bellckre prediction to be performed using three methods for predicting product reliability: The failure rate for a part under the reference conditions is calculated as:. This procedure also documents a recommended method for predicting serial system hardware reliability. Permanent damage accumulates each time the device experiences a normal power-up and power-down cycle. The activation energy is usually related to certain failure mechanisms and failure modes, and can be determined rt-332 correlating thermal cycling test data and the Coffin-Manson model.

Each reliability prediction module is designed to analyse and calculate component, sub system and system failure rates, including Mean Time Between Failure MTBFin accordance with the appropriate standard.

Therefore, in order to consider the complexity of the entire system, life tests can be conducted at the system level, treating the system as a “black box,” and the system reliability can be predicted based on the obtained failure data. Three factors are usually considered for testing: It can also be used for:.

There are reasons for bellcroe variation. Notice 1 and Notice 2 Revised generic device failure rates in Section 8, based mainly on new data for many components. Fatigue failures can occur in electronic devices due to temperature cycling and thermal shock. The most common failure mode is “conductor open. Parts Count Method II: Device and unit failure rate predictions generated using this procedure are applicable for commercial electronic products whose physical design, manufacture, installation, and reliability assurance practices meet the appropriate Telcordia or equivalent generic and product-specific requirements.

Black developed an empirical model to estimate the MTTF of a wire, taking electromigration into consideration, which is now generally known as the Black model.

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Click to Request Price Quote. Download Demo Web Demo Spec Sheet Training Screen shots click to enlarge Grid view Dialog view Chart view Features Powerful and user friendly Telcordia telecom standard reliability prediction software Combine prediction methods for complex analysis Optimize designs to meet targeed goals Bellfore components with regard to reliability and cost savings Be bellore accurate and efficient than with manual methods Take advantage of powerful ‘what if’ analytical tools Identify weakareas in a system design Build and open multiple systems and projects files Bellccore and drop components and systems between projects Powerful charting facilities.

There are many different empirical methods that have been created for specific applications.

Telcordia TR and SR Reliability Prediction Software from ITEM Software

Parts Count Method II: Method II is based on combining Method I predictions with data from laboratory tests performed in accordance with specific SR criteria. This is because the empirical and physics of failure methods calculate the system failure rate based on the predictions for the components e.

For this example, the life of an electronic component is considered to be affected by temperature. According to the handbook, the failure rate of bellcode commercial ceramic capacitor of 0. Each approach has its unique advantages and disadvantages.

Although empirical prediction standards have been used for many years, it is always wise to use them with caution. This valuable feature comes in especially handy when it is necessary to transfer data from one project or library to another.

In this article, we will provide an overview of all three approaches. For example, te-332 the Weibull distribution, the life characteristic is the scale parameter eta and for the lognormal distribution, it is the log mean. Tables needed to facilitate the calculation of reliability predictions.

The models allow reliability prediction to be performed using three methods for predicting product reliability:.